Caratteristiche Tecniche:
								
				•   Power Supply: VDD=1.2V Typical
•   VDDQ = 1.2V Typical
•   VPP - 2.5V Typical
•   VDDSPD=2.2V to 3.6V
•   Nominal and dynamic on-die termination (ODT) for    data, strobe, and mask signals
•   Low-power auto self refresh (LPASR)
•   Data bus inversion (DBI) for data bus
•   On-die VREFDQ generation and calibration
•   Single-rank
•   On-board I2 serial presence-detect (SPD) EEPROM
•   16 internal banks; 4 groups of 4 banks each
•   Fixed burst chop (BC) of 4 and burst length (BL) of 8    via the mode register set (MRS)
•   Selectable BC4 or BL8 on-the-fly (OTF)
•   Fly-by topology
•   Terminated control command and address bus
•   PCB:  Height 1.18” (30.00mm)
•   RoHS Compliant and Halogen-Free
CL(IDD) 15 cycles
Row Cycle Time (tRCmin) 46.5ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin) 260ns(min.)
Row Active Time (tRASmin) 33ns(min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
Storage Temperature -55o C to +100o C