Caratteristiche Tecniche:

• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free
CL(IDD) 15 cycles
Row Cycle Time (tRCmin) 46.5ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin) 260ns(min.)
Row Active Time (tRASmin) 33ns(min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
Storage Temperature -55o C to +100o C